Data center module

ABSTRACT

A module for data center is presented, which is used for heat sinking of a heat source. The module for data center includes a first chamber, a second chamber, and a heat pipe. The heat source is positioned in the first chamber. The second chamber is adjacent to the first chamber. In addition, the heat pipe has an evaporation end positioned inside the first chamber and a condensation end positioned inside the second chamber. The heat pipe absorbs the heat energy in the first chamber with the evaporation end, transfers the heat energy to the condensation end, and eliminates the heat energy with the condensation end.

CROSS-REFERENCE TO RELATED APPLICATIONS

This application is a continuation application of U.S. patentapplication Ser. No. 12/981,124, filed Dec. 29, 2010, entitled “DATACENTER MODULE”, by Hsi-Sheng WU, which is hereby incorporated herein inits entirety by reference.

BACKGROUND

1. Field

The present disclosure relates to a data center module, and moreparticularly to a data center module capable of preventing an electronicdevice from pollution by air.

2. Related Art

In a conventional cooling method for a data center, an air conditioningsystem of a common house or an office building is generally used, or adesign of cold and heat channels is introduced. For example, in the airconditioning system, a coolant is compressed by a compressor into ahigh-temperature and high-pressure coolant gas, which is fed into acondenser. Then, a cooling fluid is fed into the condenser by a coolingwater tower in combination with a pump for heat exchange, such that thehigh-temperature and high-pressure coolant gas is condensed into ahigh-pressure coolant liquid, which is charged into a liquid receivingvessel. Next, the high-pressure coolant liquid is fed to an expansionvalve via a pipeline for expansion, and then fed into an evaporator toform a low-pressure coolant gas for heat absorption, thereby loweringthe indoor temperature. However, the data center is generally anoperation site of high-intensity heat load, and the power of a singleserver rack may be between 20 kw and 40 kw, or even more higher. Thatis, several or tens of high heat-generation racks is filled in the wholedata center, such that the air conditioning power consumption requiredby a data center is maintained high. As a result, the heat sinkingmanner using an air conditioning system consumes too much energy. Thepower usage effectiveness (PUE) of a common data center is generallybetween 2 and 2.5 at present. That is, the data center generally needsto cost additionally 1 to 1.5 times of the power for the cooling system,and this is undoubtedly a waste of cost. In addition, with risingenvironmental protection awareness in recent years, the conception ofenergy saving and carbon reduction is always the goal sought in eachindustry to avoid ongoing exacerbation of global warming tendency.

Therefore, in order to lower the energy consumption in the conventionalcooling method of the data center, a cooling manner of introducing anexternal gas is conventionally developed. The principle is to arrange adata center at a region of high latitude, such that the cold air of theexternal environment enters the data center for heat exchange. However,impurities such as sulfide or nitride exist in the external air, so thatthe simple introduction of the external air causes pollution to theelectronic elements in the data center by the external air. As a result,this cooling manner easily causes the failure of the electronic elementsin the data center due to pollution.

SUMMARY

In view of the problems above, the present disclosure is a data centermodule, so as to solve the problem that the electronic elements in thedata center are susceptible to pollution of external air in the priorart.

The data center module according to the present disclosure is used forheat sinking of a plurality of servers in at least one server rack. Thedata center module comprises a first chamber, a second chamber, and aheat pipe. The server rack is positioned in the first chamber. Thesecond chamber is adjacent to the first chamber. In addition, the heatpipe has an evaporation end positioned inside the first chamber and acondensation end positioned inside the second chamber. The heat pipeabsorbs the heat energy emitted from the server rack in the firstchamber with the evaporation end, transfers the heat energy to thecondensation end, and eliminates the heat energy with the condensationend.

According to the data center module of the present disclosure, the heatenergy is expelled from the first chamber into the second chamberthrough the heat pipe. In addition, the first chamber is positionedinside the server rack. Therefore, the heat sink effect can be achievedwithout direct contact between the external air and the server rack.Thus, for such a data center module, the electronic members in theserver rack can be prevented from pollution caused by external air.

These and other aspects of the present disclosure will become apparentfrom the following description of the preferred embodiment taken inconjunction with the following drawings, although variations andmodifications therein may be affected without departing from the spiritand scope of the novel concepts of the disclosure.

BRIEF DESCRIPTION OF THE DRAWINGS

The accompanying drawings illustrate one or more embodiments of thedisclosure and, together with the written description, serve to explainthe principles of the disclosure. Wherever possible, the same referencenumbers are used throughout the drawings to refer to the same or likeelements of an embodiment, and wherein:

FIG. 1 is a schematic view of a data center module according to anembodiment of the present disclosure;

FIG. 2A is a flat side view of a data center module according to anembodiment of the present disclosure along a section line 2A as shown inFIG. 1;

FIG. 2B is a flat side view of a data center module according to anotherembodiment of the present disclosure;

FIG. 2C is a flat side view of a data center module according to anotherembodiment of the present disclosure;

FIG. 2D is a flat side view of a data center module according to anotherembodiment of the present disclosure;

FIG. 3 is a flat side view of a data center module according to anotherembodiment of the present disclosure;

FIG. 4 is a flat side view of a data center module according to anotherembodiment of the present disclosure;

FIG. 5 is a flat side view of a data center module according to anotherembodiment of the present disclosure;

FIG. 6 is a flat side view of a data center module according to anotherembodiment of the present disclosure;

FIG. 7 is a flat side view of a data center module according to anotherembodiment of the present disclosure;

FIG. 8 is a flat side view of a data center module according to anotherembodiment of the present disclosure;

FIG. 9A is a 3D structural view of a data center module according toanother embodiment of the present disclosure;

FIG. 9B is a flat side view of a data center module along a section line9B as shown in FIG. 9A;

FIG. 9C is a flat side view of a data center module along a section line9C as shown in FIG. 9A; and

FIG. 9D is a flat side view of a data center module along a section line9D as shown in FIG. 9A.

DETAILED DESCRIPTION

FIG. 1 is a schematic view of a data center module according to anembodiment of the present disclosure, and FIG. 2A is a flat side view ofa data center module according to an embodiment of the presentdisclosure along a section line 2A as shown in FIG. 1.

A data center module 100 according to the embodiment of the presentdisclosure is used for heat sinking of server in a server rack 200.

The data center module 100 is generally in the configuration of acabinet, so as to be conveniently delivered to all places. The datacenter module 100 can be divided into a first chamber 110 and at leastone second chamber 120. The first chamber 110 is adjacent to the secondchamber 120. In this embodiment, one second chamber 120 exists, and ispositioned above the first chamber 110; however, the number of thesecond chambers 120 and the positions of the first chamber 110 andsecond chambers 120 are not intended to limit the present disclosure.For example, in other embodiments of the present disclosure, two secondchambers 120 may exist, and are positioned at left and right sides ofthe first chamber 110, as shown in FIG. 2B.

The air in the first chamber 110 may be not circulated with air from theexternal environment. The server rack 200 is positioned in the firstchamber 110. A heat pipe 130 is disposed between the first chamber 110and the second chamber 120. The heat pipe 130 may be, but is not limitedto, a loop heat pipe (LHP). For instance, the heat pipe 130 may be acommon single heat pipe as shown in FIG. 2C, which has a shape of anelongated bar.

The heat pipe 130 has an evaporation end 134 for absorbing heat energyand a condensation end 132 for expelling heat energy. The evaporationend 134 of the heat pipe 130 is positioned inside the first chamber 110,and the condensation end 132 is positioned inside the second chamber120. In other words, the evaporation end 134 of the heat pipe 130absorbs the heat energy emitted from the server rack 200 in the firstchamber 110, and the condensation end 132 expels the heat energy to thesecond chamber 120.

In addition, the second chamber 120 may further have at least one airvent 122 in communication with the external environment. That is, theair in the second chamber 120 can be circulated and exchanged with theair in the external environment. Therefore, the heat energy is expelledto the second chamber 120 through the condensation end 132, and then thehot air in the second chamber 120 exchanges heat with the cold air inthe external environment, so as to eliminate the heat energy.Furthermore, the evaporation end 134 absorbs the heat energy, such thatthe hot air around is cooled into cold air. As shown in FIG. 2A, theserver rack 200 expels the heat energy generated by the server from theoutside of the server rack 200 with an inner fan, such that the hot airascends in the space (that is, heat channel) at the outer sides of twoserver racks 200. The cold air descends along the path (that is, coldchannel) between two server racks 200, and thus a gas loop is generatedto form convection. Therefore, the heat sink effect in the first chamber110 is relatively improved. It should be noted that in a practicalcircumstance, the temperature in the heat channel can reach 50 degreesCelsius to 60 degrees Celsius, so a person has to walk in the coldchannel of the gas loop (that is, the path between server racks 200 inthis embodiment).

In case that the inner fan of the server rack 200 expels the heat energygenerated by the server via the path between server racks 200, the hotair ascends along the path (that is, the heat channel) between the twoserver racks 200. The cold air descends along the space (that is, coldchannel) at outer sides of the server racks 200, so a gas loop isgenerated to form convection, as shown in FIG. 2D.

Referring to FIG. 2B, in an embodiment as shown in FIG. 2B, a pluralityof air vents 122 may be opened at a top surface and sidewall surfaces ofthe second chamber 120 on the left. The external air enters the secondchamber 120 through the plurality of air vents 122 at the sidewallsurfaces for heat exchange, and then is vented from the air vents 122 onthe top surface. In addition, another vent manner may adopt a form ofthe second chamber 120 on the right, that is, a plurality of air vents122 is only opened on the sidewall surface of the second chamber 120.The external air enters the second chamber 120 through the lower airvent 122 for heat exchange, and is then forced out by fan devices 170.The air may also be forced in the second chamber 120 by the fan devices170 for heat exchange. It should be noted that many types that theexternal air enters the second chamber 120 for heat exchange exist, andonly several examples are mentioned in the present disclosure, which arenot intended to limit the present disclosure.

It should be noted that the data center module 100 according to thisembodiment may be disposed in a region at a high altitude or latitude,that is, the temperature of the cold air in the external environment islow. In this way, heat exchange of the cold air with the condensationend 132 can be achieved by the natural convection between the cold airin the external environment and the air in the second chamber 120, so asto eliminate the heat energy. Therefore, the closed first chamber 110can achieve the temperature drop effect while the data center module 100according to this embodiment does not need to consume additional energy.Accordingly, such a data center module 100 can not only prevent theelectronic elements in the data center module 100 from pollution causedby external air, but also meet the spirit of energy saving and carbonreduction.

In the above embodiment, the data center module 100 disposed in a regionat a high altitude or latitude is described as an example, but notintended to limit the present disclosure. For example, the data centermodule 100 may also be disposed near a river, so as to achieve theeffect of removing the heat energy of the condensation end 132 by usingthe natural water flow of the river. Hereinafter, a method for removingheat energy through water cooling is described.

Referring to FIGS. 1 and 3, FIG. 3 is a flat side view of a data centermodule according to another embodiment of the present disclosure. Asthis embodiment is similar to the embodiment as shown in FIG. 2A,description is made according to the differences therebetween.

In this embodiment, a data center module 100 can be divided into a firstchamber 110 and a second chamber 120 positioned above the first chamber110. The first chamber 110 is a closed space, that is, the air in thefirst chamber 110 is not circulated with the air in the externalenvironment. A server rack 200 is positioned in the first chamber 110. Aheat pipe 130 has an evaporation end 134 positioned inside the firstchamber 110 and a condensation end 132 positioned inside the secondchamber 120. In addition, the data center module 100 may furthercomprise a cooling pipeline 152, which is combined with the condensationend 132 and used for removing the heat energy of the condensation end132. Furthermore, the cooling pipeline 152 is externally connected to acooling water tower 150, which can circulate a cooling fluid (forexample, cold water) in the cooling pipeline 152 with the aid of a motoror a pumping device. In other words, the data center module 100according to this embodiment can remove the heat energy of thecondensation end 132 through the circulation of the cooling fluid, sothe first chamber 110 achieves a good temperature drop effect.

It should be noted that in this embodiment, the cooling pipeline 152 incombination with the cooling water tower 150 is described as an example,but not intended to limit the present disclosure. For example, thecooling water tower 150 may be replaced by a common river, so as toprovide the kinetic energy for flowing of water by using the naturalgravity or a pump, thereby circulating the cooling fluid in the coolingpipeline 152.

Referring to FIGS. 1 and 4, FIG. 4 is a flat side view of a data centermodule according to another embodiment of the present disclosure. Asthis embodiment is similar to the embodiment as shown in FIG. 2A,description is made according to the differences therebetween.

In this embodiment, a data center module 100 can be divided into a firstchamber 110 and a second chamber 120 positioned above the first chamber110. The first chamber 110 is a closed space, that is, the air in thefirst chamber 110 is not circulated with the air in the externalenvironment. A server rack 200 is positioned in the first chamber 110. Aheat pipe 130 has an evaporation end 134 positioned inside the firstchamber 110 and a condensation end 132 positioned inside the secondchamber 120. In addition, the data center module 100 may furthercomprise a cooling pipeline 152, which is externally connected to acooling water tower 150. The cooling pipeline 152 further has a nozzle154 at an end, and the nozzle 154 is disposed in the second chamber 120.The nozzle 154 can spray a cooling fluid in the cooling pipeline 152 inthe form of atomized droplets to the condensation end 132 of the heatpipe 130 or air vents 122. The atomized droplets are evaporated uponnatural convection of air, thus absorbing a large amount of heat.Therefore, through the arrangement of the nozzle 154, the efficiency forremoving the heat energy of the condensation end 132 is improved, so thesystematic effect of the whole data center module 100 is improved.

Referring to FIGS. 1 and 5, FIG. 5 is a flat side view of a data centermodule 100 according to another embodiment of the present disclosure. Asthis embodiment is similar to the embodiment as shown in FIG. 3A,description is made according to the differences therebetween.

In this embodiment, the data center module 100 can be divided into afirst chamber 110 and a second chamber 120 positioned above the firstchamber 110. The first chamber 110 is a closed space, that is, the airin the first chamber 110 is not circulated with the air in the externalenvironment. A server rack 200 is positioned in the first chamber 110. Aheat pipe 130 has an evaporation end 134 positioned inside the firstchamber 110 and a condensation end 132 positioned inside the secondchamber 120. The data center module 100 may further comprise a coolingpipeline 152 externally connected to a cooling water tower 150, combinedwith the condensation end 132, and used for removing the heat energy ofthe condensation end 132. In addition, the data center module 100further comprises a heat exchanger 156 disposed in the first chamber110. The heat exchanger 156 can have a flow channel therein, and iscombined with the cooling pipeline 152, so a cooling fluid can flow intothe heat exchanger 156. The temperature in the heat exchanger 156 can belowered to become a cold source according to the principle above. Theheat exchanger 156 may exchange heat with the hot air in the firstchamber 110, so as to achieve the effect of lowering the temperature inthe first chamber 110.

In this embodiment, the heat exchanger 156 is additionally disposed toprovide additional heat sinking means. As a result, the overall heatsink effect of the data center module 10 is further improved.

Referring to FIGS. 1 and 6, FIG. 6 is a flat side view of a data centermodule according to another embodiment of the present disclosure. Asthis embodiment is similar to the embodiment as shown in FIG. 2A,description is made according to differences therebetween. As thisembodiment is a combination of the embodiment as shown in FIG. 4A withthe relevant embodiment of the heat exchanger 156 as shown in FIG. 5,description is made according to differences therebetween.

In this embodiment, a data center module 100 can be divided into a firstchamber 110 and a second chamber 120 positioned above the first chamber110. The first chamber 110 is a closed space, that is, the air in thefirst chamber 110 is not circulated with the air in the externalenvironment. A server rack 200 is positioned in the first chamber 110. Aheat pipe 130 has an evaporation end 134 positioned inside the firstchamber 110 and a condensation end 132 positioned inside the secondchamber 120. In addition, the data center module 100 may furthercomprise a cooling pipeline 152, which is externally connected to acooling water tower 150. The cooling pipeline 152 further has a nozzle154 at an end, and the nozzle 154 is disposed in the second chamber 120.The nozzle 154 can spray a cooling medium in the cooling pipeline 152 inthe form of atomized droplets to the condensation end 132 of the heatpipe 130 or air vents 122. The atomized droplets are evaporated uponnatural convection of air, and thus can absorb large quantities of heat,thereby removing the heat energy of the condensation end 132. Inaddition, the data center module 100 further comprises a heat exchanger156 disposed in the first chamber 110. The heat exchanger 156 can have aflow channel therein, and is combined with the cooling pipeline 152, soa cooling fluid can flow into the heat exchanger 156. The temperature inthe heat exchanger 156 can be lowered to become a cold source accordingto the principle above. The heat exchanger 156 may exchange heat withthe hot air in the first chamber 110, so as to achieve the effect oflowering the temperature in the first chamber 110. Therefore, throughthe arrangement of the nozzle 154 and the heat exchanger 156, thesystematic effect of the whole data center module 100 is improved.

Referring to FIGS. 1 and 7, FIG. 7 is a flat side view of a data centermodule according to another embodiment of the present disclosure. Asthis embodiment is similar to the embodiment as shown in FIG. 5,description is made according to differences therebetween.

In this embodiment, the data center module 100 can be divided into afirst chamber 110 and a second chamber 120 positioned above the firstchamber 110. The first chamber 110 is a closed space, that is, the airin the first chamber 110 is not circulated with the air in the externalenvironment. A server rack 200 is positioned in the first chamber 110. Aheat pipe 130 has an evaporation end 134 positioned inside the firstchamber 110 and a condensation end 132 positioned inside the secondchamber 120. The data center module 100 may further comprise a coolingpipeline 152, which is externally connected to a cooling water tower150, combined with the condensation end 132, and used for removing theheat energy of the condensation end 132. In addition, the data centermodule 100 further comprises a heat exchanger 156 disposed in the firstchamber 110. The heat exchanger 156 can have a flow channel therein, andis combined with the cooling pipeline 152, so a cooling fluid can flowinto the heat exchanger 156. The temperature in the heat exchanger 156can be lowered to become a cold source by the principle above.Furthermore, the data center module 100 according to this embodiment mayfurther comprise a freezer 160, connected to the heat exchanger 156 andthe cooling water tower 150 respectively via the cooling pipeline 152.The freezer 160 may comprise a compressor, a condenser, an expansionvalve, and an evaporator. The freezer 160 may utilize the liquid-vaporphase transition of a coolant to lower the temperature of the coolingfluid in the cooling pipeline 152, such that the cooling fluid is cooledto become ice-cold water and flows into the heat exchanger 156. Thus,the heat exchanger 156 can absorb more heat energy in the first chamber110.

Referring to FIGS. 1 and 8, FIG. 8 is a flat side view of a data centermodule 100 according to another embodiment of the present disclosure. Asthis embodiment is similar to the embodiment as shown in FIG. 6,description is made according to differences therebetween.

In this embodiment, the data center module 100 can be divided into afirst chamber 110 and a second chamber 120 positioned above the firstchamber 110. The first chamber 110 is a closed space, that is, the airin the first chamber 110 is not circulated with the air in the externalenvironment. A server rack 200 is positioned in the first chamber 110. Aheat pipe 130 has an evaporation end 134 positioned inside the firstchamber 110 and a condensation end 132 positioned inside the secondchamber 120. In addition, the data center module 100 may furthercomprise a cooling pipeline 152 externally connected to a cooling watertower 150. The cooling pipeline 152 further has a nozzle 154 at an end,and the nozzle 154 is disposed in the second chamber 120. The nozzle 154can spray a cooling fluid in the cooling pipeline 152 in the form ofatomized droplets to the condensation end 132 of the heat pipe 130 or anair vent 122. The atomized droplets are evaporated upon naturalconvection of air, thus absorbing a large amount of heat, therebyremoving the heat energy of the condensation end 132.

In addition, the data center module 100 further comprises a heatexchanger 156 disposed in the first chamber 110. The heat exchanger 156can have a flow channel therein, and is combined with the coolingpipeline 152, so a cooling fluid can flow into the heat exchanger 156.The temperature in the heat exchanger 156 can be lowered to become acold source according to the principle above. Furthermore, the datacenter module 100 according to this embodiment may further comprise afreezer 160 connected to the heat exchanger 156 and the cooling watertower 150 respectively via the cooling pipeline 152. The freezer 160 maycomprise a compressor, a condenser, an expansion valve, and anevaporator. The freezer 160 may utilize the phase transition of acoolant to lower the temperature of the cooling fluid in the coolingpipeline 152, such that the cooling fluid is cooled and becomes ice-coldwater and flows into the heat exchanger 156. Thus, the heat exchanger156 can absorb more heat energy from the first chamber 110.

Referring to FIGS. 9A to 9D, FIG. 9A is a 3D structural view of a datacenter module according to another embodiment of the present disclosure;FIG. 9B is a flat side view of a data center module along a section line9B as shown in FIG. 9A; FIG. 9C is a flat side view of a data centermodule along a section line 9C as shown in FIG. 9A; and FIG. 9D is aflat side view of a data center module according to another embodimentof the present disclosure along a section line 9D as shown in FIG. 9A.As this embodiment is similar to the embodiment as shown in FIG. 2A,description is made according to differences therebetween.

In this embodiment, an evaporation end 134 of a data center module 100may extend from the upper part to the lower part in the first chamber110, and the evaporation end 134 may be positioned between two serverracks 200, as shown in FIGS. 9A and 9B.

The data center module 10 may be further disposed with a first fan 180and a second fan 190 therein. The first fan 180 is disposed in the firstchamber 110, with the air outlet of the first fan 180 facing theevaporation end 134. The first fan 180 runs and generates an air flowwhich is blown to the evaporation end 134, thereby generating forcedconvection in the first chamber 110 as shown in FIG. 9C, so as toimprove the heat exchange efficiency in the first chamber 110. Inaddition, the second fan 190 is disposed in the second chamber 120, andadjacent to the condensation end 132. The second fan 190 runs andgenerates forced convection, such that the heat energy of thecondensation end 132 can be removed by the external cold air morequickly, as shown in FIG. 9D.

It should be noted that in the data center module 100 according to theembodiment of the present disclosure, the first fan 180 and the secondfan 190 are further disposed to achieve the effect of forced convection.However, upon forced convection by using a fan, there are many examplesof the combination of the positions of the fans, the opening position ofthe air vents 122, the positions of the heat pipes 130, and the form ofgas flow circulation. The drawings in this embodiment are described withreference to an example, which is not intended to limit the presentdisclosure. Any effect of forced gas flow circulation achieved throughdisposition of fans shall fall within the scope of the presentdisclosure.

In the data center module according to the embodiment of the presentdisclosure, the heat energy in the first chamber is expelled to thesecond chamber through the heat pipe. In addition, the first chamber inwhich the heat source is positioned is a closed space. Therefore, theheat sink effect can be achieved without direct contact between theexternal air and the heat source. Accordingly, such a data center modulecan prevent the heat source from pollution caused by external air.Moreover, the data center module according to this embodiment can befurther disposed with a nozzle to spray the atomized droplets, a coolingwater pipe, a heat exchanger, a freezer, and fans, so as to improve thecooling efficiency of the data center module.

What is claimed is:
 1. A data center module, for dissipating heat in adata center, comprising: a cabinet body, having a first chamber and asecond chamber separated from the first chamber by a wall which islocated in the cabinet body, the first chamber defining a cold channeland a heat channel; at least one server rack, having a plurality ofservers placed therein, the at least one server rack being disposed inthe first chamber and having a first side and a second side opposite toeach other, with the first side facing to the heat channel, and thesecond side facing to the cold channel; and a heat pipe, disposed on andpenetrating the wall, the heat pipe having an evaporation end positionedinside the first chamber and a condensation end positioned inside thesecond chamber; wherein a fan in the at least one server rack flows theheat generated by the servers in form of an air flow from the first sideof the at least one server rack through the heat channel and theevaporation end, with the heat pipe absorbing the heat of the air flowand transferring the absorbed heat to the condensation end, before theair flow flows through the cold channel and returns to the at least oneserver rack from the second side of the at least one server rack.
 2. Thedata center module according to claim 1, wherein the second chamberfurther has at least an air vent in communication with externalenvironment, and natural convection is generated between the air in thesecond chamber and the air in the external environment, so as toeliminate the heat energy of the condensation end.
 3. A data centermodule, for dissipating heat in a data center, comprising: a cabinetbody, having a first chamber and a second chamber separated from thefirst chamber by a wall which is located in the cabinet body, the firstchamber defining a cold channel and a heat channel; at least one serverrack, having a plurality of servers placed therein, the at least oneserver rack being disposed in the first chamber and having a first sideand a second side opposite to each other, with the first side facing tothe heat channel, and the second side facing to the cold channel; a heatpipe, disposed on and penetrating the wall, the heat pipe having anevaporation end positioned inside the first chamber and a condensationend positioned inside the second chamber, and a cooling pipeline havinga nozzle at one end, wherein the nozzle is disposed in the secondchamber, and sprays atomized liquid to the condensation end or an airvent.
 4. The data center module according to claim 3, wherein thecooling pipeline is connected to a cooling water tower.
 5. The datacenter module according to claim 3, wherein the cooling pipeline isconnected to a pump, so a cooling fluid circularly flows in the coolingpipeline.
 6. The data center module according to claim 3, furthercomprising a heat exchanger disposed in the first chamber and connectedto the cooling pipeline.
 7. The data center module according to claim 6,wherein the cooling pipeline is connected to a cooling water tower. 8.The data center module according to claim 6, wherein the coolingpipeline is connected to a pump, so a cooling fluid circularly flows inthe cooling pipeline.
 9. The data center module according to claim 6,further comprising a freezer connected to the heat exchanger via thecooling pipeline.
 10. The data center module according to claim 9,wherein the cooling pipeline is connected to a cooling water tower. 11.The data center module according to claim 9, wherein the coolingpipeline is connected to a pump, so a cooling fluid circularly flows inthe cooling pipeline.
 12. A data center module, for dissipating heat ina data center, comprising: a cabinet body, having a first chamber and asecond chamber separated from the first chamber by a wall which islocated in the cabinet body, the first chamber defining a cold channeland a heat channel; at least one server rack, having a plurality ofservers placed therein, the at least one server rack being disposed inthe first chamber and having a first side and a second side opposite toeach other, with the first side facing to the heat channel, and thesecond side facing to the cold channel; a heat pipe, disposed on andpenetrating the wall, the heat pipe having an evaporation end positionedinside the first chamber and a condensation end positioned inside thesecond chamber, and a cooling pipeline combined with the condensationend of the heat pipe and used for eliminating the heat energy of thecondensation end.
 13. The data center module according to claim 12,wherein the cooling pipeline is connected to a cooling water tower. 14.The data center module according to claim 12, wherein the coolingpipeline is connected to a pump, so a cooling fluid circularly flows inthe cooling pipeline.
 15. The data center module according to claim 12,further comprising a heat exchanger disposed in the first chamber andconnected to the cooling pipeline.
 16. The data center module accordingto claim 15, wherein the cooling pipeline is connected to a coolingwater tower.
 17. The data center module according to claim 15, whereinthe cooling pipeline is connected to a pump, so a cooling fluidcircularly flows in the cooling pipeline.
 18. The data center moduleaccording to claim 15, further comprising a freezer connected to theheat exchanger via the cooling pipeline.
 19. The data center moduleaccording to claim 18, wherein the cooling pipeline is connected to acooling water tower.
 20. The data center module according to claim 18,wherein the cooling pipeline is connected to a pump, so a cooling fluidcircularly flows in the cooling pipeline.
 21. The data center moduleaccording to claim 1, further comprising a first fan disposed in thefirst chamber and generating forced convection in the first chamber. 22.The data center module according to claim 1, further comprising a secondfan disposed in the second chamber and generating forced convection inthe second chamber.